Vol.11, No.1 (1998) 87-101
Abstract The recently proposed hybrid integration technique of planar/break NRD-guide circuits and the rapid progress in the development of three-dimen-si-o-nal (3D) MMICs as well as the micromachined high-frequency ICs based on MEMS suggest that a unified multilayered framework of integrated multifrequency multichip modules be attractive for low-cost high-performance microwave and millimeter-wave circuits and systems. This new generalized scheme makes it possible to exploit complementary distinctive advantages of various strip and slot planar structures as well as NRD-guide within a single framework. This paper reviews briefly the state-of-the-art of research activities on hybrid 3D planar and nonplanar structures for microwave and millimeter-wave ICs with emphasis on the newly proposed hybrid planar/NRD circuits. Potential challenging problems in connection with the 3D design and integration are discussed and future R&D directions are also indicated. In particular, it is suggested that hybrid multilayered scheme involving dissimilar structures can be effectively integrated in a monolithic format.
Key words: Microwave circuits, multilayered technologies, hibrid technilogies, planar strucure, waveguide structure, band pass filter.